Sealant Dispensing Machine
| Offer Type: |
|
|---|---|
| Offer Post Time: | 2009-11-07 |
| Expiration Date: | 2009-12-27 |
| Details: |
The machine is specially designed for the electronic chip sealant (bonding room) and COG sealant. Considering about the different trajectory between machine and black epoxy, we used some appropriative procedures to make modification and solved the problem that common sealant dispenser which is less of practicality can not be used in most of bonding rooms to produce widely, the machine is complicated in operation and slow in speed. However, the specific sealant dispenser made by our company had considered adequately the demand of bonding room and COG. It has the advantages with cheap price, high speed and simple operation. And it can dispense several colloids, such as black epoxy, reb epoxy, polyester resin and epoxy resin. Because we have bonding room and we are also the manufacturer in bonding OEM, so we have rich experience in programme. Our design, manufacturing and accessment stand on a user's angle to reach a perfect effect. Nowaday, It is enough for our bonding room which owns six AB510 bonding machines matching one bonding sealant dispenser to work by a ordinary worker.
Dimension: 730mmx750mmx580 Worktable area: 215mmX180mmx2 Cantalever route: X axis 330mm Y axis 200mm Step resolution: 0.00105mm Operate interface: Make dialogue between man and machine with clue on limitation of operation. Input from: Monochrome touch screen and keyboard Double heating control: Preheating control on worktable, prheating control on epoxy Preheating board: Vacuum insulated technique. Data store: 50 models and memory in numbers Working cycle: 4s/100lines/1 |
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